NDLI: Materials and processes issues in fine pitch eutectic solder flip chip interconnection

Content Provider	IEEE Xplore Digital Library
Author	Liu, C. Hendriksen, M.W. Hutt, D.A. Conway, P.P. Whalley, D.C.
Copyright Year	2004
Description	Author affiliation: Wolfson Sch. of Mech. & Manuf. Eng., Loughborough Univ., UK (Liu, C.)
Abstract	New product designs within the electronics packaging industry continue to demand interconnects at microscopic geometry, both at the integrated circuit (IC) and supporting board level, thereby creating numerous manufacturing challenges. Flip chip on board (FCOB) applications are currently being driven by competitive manufacturing costs and the need for higher volume and robust production capabilities. One of today's low cost FCOB solutions has emerged as an extension of the existing infrastructure for surface mount technology (SMT) and combines an under bump metallisation (UBM) with a stencil printing solder bumping process, to generate mechanically robust joint structures with low electrical resistance between chip and board. Although electroless Ni plating of the UBM, and stencil printing for solder paste deposition, have been widely used in commercial industrial applications, there still exists a number of technical issues related to these materials and processes as the joint geometry is further reduced. This paper reports on trials with electroless Ni plating and stencil paste printing and the correlation between process variables in the formation of bumps and the shear strength of such bumps at different geometries. The effect of precise control of the tolerances of squeegees, stencils and wafer fixtures was examined to enable the optimisation of the materials, processes and tooling for reduction of bumping defects.
Starting Page	213
Ending Page	220
File Size	1116892
Page Count	8
File Format	PDF
ISBN	0780386205
DOI	10.1109/HPD.2004.1346700
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-07-03
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Flip chip Printing Integrated circuit interconnections Costs Robustness Surface-mount technology Geometry Product design Electronics packaging Electronics industry
Content Type	Text
Resource Type	Article

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