NDLI: Contactless Interconnection Methods - Capacitively Coupled Interconnection in Mobile Devices

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Contactless Interconnection Methods - Capacitively Coupled Interconnection in Mobile Devices

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Contactless Interconnection Methods - Capacitively Coupled Interconnection in Mobile Devices

Content Provider	IEEE Xplore Digital Library
Author	Jussila, A. Takaneva, J.
Copyright Year	2008
Description	Author affiliation: Devices R&D, Nokia Corp., Tampere (Jussila, A.; Takaneva, J.)
Abstract	Contactless interconnection methods are studied as possible alternatives for galvanic interconnection in mobile devices. This is due to ever-increasing requirements for the connector size and bandwidth. Capacitively coupled interconnection is implemented on a PCB level and signal transmission with pulse signaling is demonstrated for 1 MHz, 10 MHz and 40 MHz PRBS signals. Different schemes for signal transmission through a capacitive interconnection are discussed and their potential benefits are evaluated.
Starting Page	1
Ending Page	4
File Size	4133439
Page Count	4
File Format	PDF
ISBN	9781424423170
DOI	10.1109/SPI.2008.4558333
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-05-12
Publisher Place	France
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit interconnections Connectors Contacts Galvanizing Flexible printed circuits Couplings Dielectric materials Degradation Electromagnetic interference Electrostatic discharge
Content Type	Text
Resource Type	Article

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