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Thermal design and structure of thick film hybrid IC based on insulated aluminium substrate

Content Provider	IEEE Xplore Digital Library
Author	Sakamoto, N. Kanai, T. Ohkawa, K.
Copyright Year	1993
Description	Author affiliation: Sanyo Electric Co Ltd., Osaka, Japan (Sakamoto, N.; Kanai, T.; Ohkawa, K.)
Abstract	The structural characteristics of an insulated metal substrate based on aluminum (IMST) and a circuit assembly innovation by IMST (CAIT) mounting technology are discussed. It is shown that IMST has an excellent heat dissipation property, which provides the active and passive elements mounted on this substrate with a very low thermal resistance from them to the substrate. The hybrid IC based on this substrate enables the high density packaging of circuits including power semiconductors. The relationship between the structure and thermal resistance for each circuit component mounted on the IMST substrate is described.
Starting Page	186
Ending Page	193
File Size	611076
Page Count	8
File Format	PDF
ISBN	0780308638
DOI	10.1109/STHERM.1993.225315
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1993-02-02
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thick films Hybrid integrated circuits Substrates Thermal resistance Insulation Aluminum Assembly Technological innovation Resistance heating Integrated circuit packaging
Content Type	Text
Resource Type	Article

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