NDLI: Chip-package co-design of a 4.7 GHz VCO

Content Provider	IEEE Xplore Digital Library
Author	Donnay, S. Vaesen, K. Pieters, P. Diels, W. Wambacq, P. De Raedt, W. Beyne, E. Engels, M. Bolsens, I.
Copyright Year	1999
Description	Author affiliation: IMEC, Leuven, Belgium (Donnay, S.; Vaesen, K.; Pieters, P.; Diels, W.; Wambacq, P.; De Raedt, W.; Beyne, E.; Engels, M.; Bolsens, I.)
Abstract	Wireless communication applications require low-power and highly integrated transceiver solutions. In particular, the integration of the RF front-end poses a great challenge in these applications, as traditional front-end implementations require a large number of external passive components. "Single-package" integration of complete transceivers based on an MCM-D technology with integrated passives is presented in this paper as a superior alternative to overcome the many problems of single-chip CMOS integration. To benefit from all the advantages offered by this approach, a careful co-design of ICs and package is required. This is illustrated with the design of a 4.7 GHz VCO for a 5.2 GHz HIPERLAN-2 application.
Starting Page	145
Ending Page	148
File Size	387643
Page Count	4
File Format	PDF
ISBN	0780366433
DOI	10.1109/ICM.2000.884826
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-11-22
Publisher Place	Kuwait
Access Restriction	Subscribed
Rights Holder	Kuwait University
Subject Keyword	Voltage-controlled oscillators CMOS technology Radio frequency Inductors Transceivers CMOS process Band pass filters Integrated circuit technology Costs Packaging
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Mr. Siddhartha Mukherjee siddhartha@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	ndl-support@iitkgp.ac.in
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