NDLI: 3D technologies for reconfigurable architectures

Content Provider	IEEE Xplore Digital Library
Author	Clermidy, F. Turkyimaz, O. Billoint, O. Gaillardon, P.E.
Copyright Year	2014
Description	Author affiliation: Univ. de Grenoble, Grenoble, France (Clermidy, F.; Turkyimaz, O.; Billoint, O.) \|\| LSI, EPFL, Lausanne, Switzerland (Gaillardon, P.E.)
Abstract	FPGA have always taken benefit of the most advanced technology nodes for offering better performance than CPU and better time-to-market than ASSP. However, with the slow-down of technologies and its exponentially increasing cost, FPGA race towards better integration is nowadays compromised. One alternative path to scaling is to go 3D. This promising solution can offer scaling at a lower cost while solving some FPGA issues such as yield or I/Os management. However, 3D solutions come with some drawbacks with heterogeneous performances of 3D/2D links and limited 3D interconnections. In this paper, we show some recent advances on the usage of 3D technologies for enhancing FPGA capacities.
Starting Page	1
Ending Page	2
File Size	256722
Page Count	2
File Format	PDF
ISBN	9781479958108
DOI	10.1109/ReCoSoC.2014.6861337
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-05-26
Publisher Place	France
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	3D Three-dimensional displays FPGA Monolithic integrated circuits TSV Logic gates Delays Nanowires Through-silicon vias Field programmable gate arrays Monolithic integration
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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