NDLI: Optoelectronic packaging and polymer waveguides for multichip module and board-level optical interconnect applications

Content Provider	IEEE Xplore Digital Library
Author	Liu, Y.S. Cole, H.S. Guida, R. Sitnik, T. Balch, E.W. Bristow, J. Yue Lin Marta, T.
Copyright Year	1995
Description	Author affiliation: Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA (Liu, Y.S.; Cole, H.S.; Guida, R.; Sitnik, T.; Balch, E.W.)
Abstract	In this paper, we describe an effort in developing low-cost optoelectronic packaging and interconnect technologies for board-level optical interconnect applications. Specifically, our work includes (a) hybrid packaging of electrical and optical components, e.g., vertical-cavity surface-emitting-laser (VCSEL) devices using a thin-film embedded-chip MCM technology, (b) fabrication of optical polymer waveguides for board-level interconnect using standard planar processes, and (c) use of an adaptive interconnect process for waveguide patterning to accommodate alignment between optical device and waveguides. Our approach attempts to employ planar fabrication processes widely used in IC manufacturing and the existing packaging technology already developed in the electronic industry to optoelectronic packaging and interconnect for board-level applications. Our goal is to reduce both recurring and nonrecurring costs for the optical interconnect technology insertion.
Starting Page	185
Ending Page	188
File Size	831031
Page Count	4
File Format	PDF
ISBN	0780327365
DOI	10.1109/ECTC.1995.514382
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Polymers Optical waveguides Optical planar waveguides Optical waveguide components Planar waveguides Optical interconnections Optical devices Optical device fabrication Electronics packaging Integrated circuit packaging
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Libarray of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Polymer waveguides for optoelectronic devices, packaging and interconnects

A polymer waveguide-based 40 Gb/s optical bus backplane for board-level optical interconnects

Polymer optical interconnect technology (POINT) optoelectronic packaging and interconnect for board and backplane applications

Integrated polymer waveguides for absorbance detection in chemical analysis systems

Optical interconnect demonstrator with embedded waveguides and butt-coupled optoelectronic modules

Polymer-Waveguide-Based Board-Level Optical Interconnect Technology for Datacom Applications

Fabrication Issues For Free-space Optics At The Board Packaging Level

Recent Trend of Optical Circuit Board in Taiwan

Connectorized packaging for PLC devices

Optoelectronic packaging and polymer waveguides for multichip module and board-level optical interconnect applications

Similar Documents

Polymer waveguides for optoelectronic devices, packaging and interconnects

A polymer waveguide-based 40 Gb/s optical bus backplane for board-level optical interconnects

Polymer optical interconnect technology (POINT) optoelectronic packaging and interconnect for board and backplane applications

Integrated polymer waveguides for absorbance detection in chemical analysis systems

Optical interconnect demonstrator with embedded waveguides and butt-coupled optoelectronic modules

Polymer-Waveguide-Based Board-Level Optical Interconnect Technology for Datacom Applications

Fabrication Issues For Free-space Optics At The Board Packaging Level

Recent Trend of Optical Circuit Board in Taiwan

Connectorized packaging for PLC devices

Optoelectronic packaging and polymer waveguides for multichip module and board-level optical interconnect applications