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  1. IEEE Transactions on Components, Hybrids, and Manufacturing Technology
  2. Year : 1984 Volume : 7
  3. Issue 2
  4. Bond-Integrity Testing of Sapphire Chips Mounted with Eutectic Preforms
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Year : 1993 Volume : 16
Year : 1992 Volume : 15
Year : 1991 Volume : 14
Year : 1990 Volume : 13
Year : 1989 Volume : 12
Year : 1988 Volume : 11
Year : 1987 Volume : 10
Year : 1986 Volume : 9
Year : 1985 Volume : 8
Year : 1984 Volume : 7
Issue 4
Issue 3
Issue 2
Editorial
The Microstructure of RuO2Thick Film Resistors and the Influence of Glass Particle Size on their Electrical Properties
Cleaning Processes For HIC's with Solder Paste
Bond-Integrity Testing of Sapphire Chips Mounted with Eutectic Preforms
Silicon-On-Silicon Packaging
The VLSI Package-An Analytical Review
Failure Modes of InGaAsP/InP Lasers Due to Adhesives
Issue 1
Year : 1983 Volume : 6
Year : 1982 Volume : 5
Year : 1981 Volume : 4
Year : 1980 Volume : 3
Year : 1979 Volume : 2
Year : 1978 Volume : 1

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Bond-Integrity Testing of Sapphire Chips Mounted with Eutectic Preforms

Content Provider IEEE Xplore Digital Library
Author Faith Jr., T. Irven, R.
Copyright Year 1978
Abstract The 3000-5000 Å polysilicon film deposited on the back surface of a sapphire wafer during the polysilicon-gate deposition process is shown to provide a satisfactory bonding layer for eutectic mounting of silicon-on-sapphire (SOS) chips to gold-plated packages using Au-Si eutectic preforms, provided that the back-surface polysilicon film is maintained in the undoped state during subsequent wafer processing. N+doped polysilicon films provide less satisfactory bonding surfaces, passing all MIL-STD-883B environmental tests, but failing more severe tests which the undoped polysilicon films are shown to pass. Bare sapphire is shown to provide a surprisingly good bonding interface with Au-Si eutectic preforms giving MIL-STD-883B test results equivalent to the undoped polysilicon films and destructive-test results which were comparable to the n+ polysilicon films.
Sponsorship IEEE Electronic Industries Alliance American Society of Mechanical Engineering (ASME) NBS SAE
Starting Page 189
Ending Page 192
Page Count 4
File Size 600759
File Format PDF
ISSN 01486411
Volume Number 7
Issue Number 2
Language English
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date 1984-06-01
Publisher Place U.S.A.
Access Restriction Subscribed
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword Preforms Wafer bonding Packaging Silicon Semiconductor films Temperature distribution Circuit testing Thermal force Electric shock
Content Type Text
Resource Type Article
Subject Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Engineering Electrical and Electronic Engineering
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