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Content Provider | The American Society of Mechanical Engineers (ASME) Digital Collection |
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Author | Tanaka, Hiroyuki Numata, Takashi |
Copyright Year | 2005 |
Abstract | This paper presents a method of finite element analysis for calculating moisture concentration in non-isothermal and non-steady states of moisture for integrated circuit packages composed of dissimilar moisture-permeable materials. The method can address non-Fickian behavior of materials in moisture diffusivity. Specimens were put on a hot plate after pre-conditioning in a moist environment. Distribution of moisture concentration in the specimen used in adhesion strength measurement was calculated in the temperature-change process. Comparatively large change in moisture concentration occurs in the neighborhood of the dissimilar material interface during that process, demonstrating that adhesion strength between die-attach material and printed circuit board at high temperatures might have greater moisture-sensitivity than at low temperatures. |
Sponsorship | Heat Transfer Division and Electronic and Photonic Packaging Division |
Starting Page | 1153 |
Ending Page | 1158 |
Page Count | 6 |
File Format | |
ISBN | 0791842002 |
DOI | 10.1115/IPACK2005-73139 |
e-ISBN | 0791837629 |
Volume Number | Advances in Electronic Packaging, Parts A, B, and C |
Conference Proceedings | ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference |
Language | English |
Publisher Date | 2005-07-17 |
Publisher Place | San Francisco, California, USA |
Access Restriction | Subscribed |
Subject Keyword | Moisture sensitivity level Dissimilar material interface Non-fickian Moisture concentration Packaging material Adhesion strength Integrated circuits Adhesion High temperature |
Content Type | Text |
Resource Type | Article |
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