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Content Provider | SpringerLink |
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Author | Yu, Yang Xia, Zhidong Guo, Fu Shi, Yaowu |
Copyright Year | 2008 |
Abstract | In the present work, lead-free solder balls were manufactured by a uniform droplet spray (UDS) method. The solder used to produce solder balls was based on the Sn-3.8Ag-0.7Cu alloy. Different amounts of cerium-based mixed rare-earth (RE) elements were added into the Sn-3.8Ag-0.7Cu solder alloy in order to examine the effects of small amounts of RE additions on the physical properties, microstructure, and surface smoothness of the solder balls. Results show that a small amount of RE addition has no obvious effect on the melting temperature, but it decreases the nucleation undercooling degree. Moreover, a small amount of RE addition (<0.25 wt.%) can improve the surface smoothness of the solder balls. However, when the RE was added up to 0.5 wt.%, the surface smoothness of the solder balls was deteriorated. From observations of the microstructure of the solder balls, it is obvious that the RE addition affects solidification behavior, and as a result, the surface smoothness of the solder balls. |
Starting Page | 975 |
Ending Page | 981 |
Page Count | 7 |
File Format | |
ISSN | 03615235 |
Journal | Journal of Electronic Materials |
Volume Number | 37 |
Issue Number | 7 |
e-ISSN | 1543186X |
Language | English |
Publisher | Springer US |
Publisher Date | 2008-04-23 |
Publisher Place | Boston |
Access Restriction | Subscribed |
Subject Keyword | Lead-free solder ball rare-earth element uniform droplet spray (UDS) Solid State Physics and Spectroscopy Electronics and Microelectronics, Instrumentation Characterization and Evaluation of Materials Optical and Electronic Materials |
Content Type | Text |
Resource Type | Article |
Subject | Condensed Matter Physics Electronic, Optical and Magnetic Materials Materials Chemistry Electrical and Electronic Engineering |
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