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Content Provider | IEEE Xplore Digital Library |
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Author | Mengquan Li Juan Yi Weichen Liu Wei Zhang Lei Yang Sha, E.H.-M. |
Copyright Year | 2015 |
Description | Author affiliation: Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong, China (Wei Zhang) || Coll. of Comput. Sci., Chongqing Univ., Chongqing, China (Mengquan Li; Juan Yi; Weichen Liu; Lei Yang; Sha, E.H.-M.) |
Abstract | In the dark silicon era, a fundamental problem is: given a real-time computation demand represented by a set of independent applications with their own power consumption, how to determine if an on-chip multiprocessor system is able to respond to this demand and maintain its reliability by keeping every core within the safe temperature range. In this paper, we first present a novel thermal model for the prediction of chip peak temperature assuming the application-to-core mapping is determined. The mathematical model combines linearized steady-state thermal model with empirical scaling factors to achieve significantly improved accuracy and running efficiency. Based on it, a MILP-based approach is presented to find the optimal application-to-core assignment such that the computation demand is met and the chip temperature is minimized. At last, if the minimized temperature still exceeds the safe temperature threshold, a novel heuristic algorithm, called temperature threshold-aware result handling (TTRH), is proposed to drop certain applications selectively from immediate execution, and lower the chip peak temperature to the safety threshold. Extensive performance evaluation shows that the MILP-based approach can reduce the chip peak temperature by 9.1 $^{o}C$ on average compared to traditional techniques. TTRH algorithm can further lower the chip peak temperature by 1.38° C on average with the application dropping rate of less than 4.35%. |
Starting Page | 688 |
Ending Page | 693 |
File Size | 790945 |
Page Count | 6 |
File Format | |
e-ISBN | 9781479989379 |
DOI | 10.1109/HPCC-CSS-ICESS.2015.59 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2015-08-24 |
Publisher Place | USA |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Temperature sensors Power demand Temperature Thermal resistance Silicon Mathematical model |
Content Type | Text |
Resource Type | Article |
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