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Unpowered opens test with X-ray laminography

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Unpowered opens test with X-ray laminography

Content Provider	IEEE Xplore Digital Library
Author	Oresjo, S.
Copyright Year	1996
Description	Author affiliation: Hewlett-Packard Co., Loveland, CO, USA (Oresjo, S.)
Abstract	The author briefly describes how X-ray laminography can be used to detect solder opens. With this method X-ray images are taken of the device under test (DUT). The lead content in solder makes the solder joints appear clearly in the image. Using image processing algorithms and also calibration information, the captured image of the solder joint is automatically translated into key mechanical measurements of the solder joint, such as heel height, center height, toe height, average height, fillet length and width at the toe and the heel. A key difference in this method is that these mechanical characteristics of the solder joint are used by the image processor to automatically determine an open solder joint from a good solder joint.
File Size	112235
File Format	PDF
ISBN	0780335414
ISSN	10893539
DOI	10.1109/TEST.1996.557159
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-10-20
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Testing Soldering X-ray imaging X-ray detection X-ray detectors Lead Image processing Calibration Length measurement Mechanical variables measurement
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering Applied Mathematics

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