NDLI: Applying optical interconnects to electronic systems. Promise vs. practicality

Content Provider	IEEE Xplore Digital Library
Author	Bristow, J. Lehman, J. Hibbs-Brenner, M. Yue Liu
Copyright Year	1997
Description	Author affiliation: Honeywell Technol. Centre, Minneapolis, MN, USA (Bristow, J.; Lehman, J.; Hibbs-Brenner, M.; Yue Liu)
Abstract	Optical interconnects have long promised to solve a number of problems assumed to exist in electronic systems. A wealth of technology exists in the area, yet few electronic systems today employ optical interconnects. In many cases, it is the cost of optical interconnects which prevents their widespread adoption, as little fundamental advantage is offered by most applications of optical interconnects. The decreasing cost of optoelectronic technology and of its incorporation into electronic systems will enable further penetration of the market. Plastic fiber is likely to provide a competitive solution for intercabinet interconnects, while both high density fiber backplanes and polymer backplanes are likely to impact first high performance computer systems and eventually a broader range of systems, while free space interconnects will facilitate both advanced versions of existing architectures and the implementation of new systems. The key to practical implementation lies in providing transparency to the system integrator to minimize the departure from established practices. Significant progress is also being made in a new direction in which the inherent advantages of optics can be exploited in unique architectures, while still implementing logic functions in electronics, however such systems are unlikely to find widespread use in the near future.
Starting Page	54
Ending Page	59
File Size	743616
Page Count	6
File Format	PDF
ISBN	0818679751
DOI	10.1109/MPPOI.1997.609094
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-06-17
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Optical interconnections Integrated circuit interconnections Bandwidth Optical signal processing LAN interconnection Backplanes Electronics packaging Costs Optical fiber cables Copper
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Libarray of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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