Please wait, while we are loading the content...
Please wait, while we are loading the content...
Content Provider | IEEE Xplore Digital Library |
---|---|
Author | Ming-chuan Han Bei-yue Yan Yao, J.Z. Tu Anh Tran Lee, S. Jun Li |
Copyright Year | 2007 |
Description | Author affiliation: Freescale Semicond. Inc., Tianjin (Ming-chuan Han; Bei-yue Yan; Yao, J.Z.; Jun Li) |
Abstract | With driving interconnect dimensions to ever-smaller sizes, the RC delay becomes the dominant factor to impact IC performance. The RC delay time is controlled by the resistance of the metal lines in the interconnect structure of an IC, and the capacitance between the metal lines. To reduce RC delay, copper interconnects were introduced to replace aluminum. At the same time, the low K material has been widely used to replace the traditional $SiO_{2}$ inter-layer dielectric. The introduction of low k material into wafer technology brings new challenges on assembly wire bonding process. Coupling with low k dielectric material is the continuing dimension shrinkage in bond pad size and pitch. In this paper, a CMOS65 nm low k device with 47um fine pitch was designed as test vehicle in developing the wire bond process capability on BGA package. Gold wire type, bonding capillary, and wire bonding parameters, were selected as critical factors in this study. This paper describes the key 1st bond parameter optimization on CMOS65 low K device. Different gold wire type (2N, 3N) and different capillary from different vendors were studied. The Newly- designed capillary from SPT aimed to improve wire stitch pull strength was also studied to improve 2N gold wire 2nd bond stitch bond which have weak stitch bond strength result from its big hardness. Critical responses such as Ball size, Ball height / bonded ball diameter ratio, bonded ball placement, wire pull strength, ball shear strength, and stitch pull strength were studied to understand the wire bonding effect of low k and 47 μm pad pitch. DOE (Design of Experiment) and RSM (response surface methodology) was used to optimize the wire bond process. Thermal aging test coupled with wire pull and ball shear test and their corresponding failure mode were studied. The IMC (Inter Metallic Coverage) of the Au-Al was also tested. The optimized process window/recipe had passed package reliability test with C65 low K device with 47 mum fine pitch. |
Starting Page | 613 |
Ending Page | 617 |
File Size | 2676304 |
Page Count | 5 |
File Format | |
ISBN | 9781424413249 |
DOI | 10.1109/EPTC.2007.4469708 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2007-12-10 |
Publisher Place | Singapore |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Electronics packaging Wire Bonding processes Testing Dielectric materials Gold Wafer bonding Delay effects Radio control Capacitance |
Content Type | Text |
Resource Type | Article |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
Sl. | Authority | Responsibilities | Communication Details |
---|---|---|---|
1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
7 | National Digital Libarray of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
Loading...
|