NDLI: Understanding how to model difficult features and related physical effects in electrical packages

Please wait, while we are loading the content...

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)

2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems

19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems

2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems

2008 IEEE-EPEP Electrical Performance of Electronic Packaging

2007 IEEE Electrical Performance of Electronic Packaging

2006 IEEE Electrical Performane of Electronic Packaging

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging

Electrical Performance of Electronic Packaging (IEEE Cat. No. 05TH8817)

Technical Program Committee

Table of contents

Channel timing error analysis for DDR2 memory systems

Fully integrated AC coupled interconnect using buried bumps

Signal integrity and robustness of ACCI packaged systems

Electrical / optical high speed scalability link implementation

Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz

Extraction of frequency dependent RLCG parameters of the packaging interconnects on low-loss substrates from frequency domain measurements

Impact of probe placement on high frequency measurements of on-chip interconnects

Low cost CPU I/O analyzer under system conditions

Losses caused by roughness of metallization in printed-circuit boards

Model-order estimation and reduction of distributed interconnects via improved vector fitting

Waveform relaxation techniques for simulation of coupled interconnects with frequency-dependent parameters

Combining rational interpolation with the vector fitting method

Efficient simulation of transmission lines with EBG ground planes

EBG-enhanced split power planes for wideband noise suppression

EMI evaluation of a differential signaling interconnect at 3.2 Gbps

Near field and far field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications

Characterization of microstrip interconnects over gridded ground planes

Performance prediction of on-chip high-throughput global signaling

Linear circuit model combination for coupled noise simulation by using directional junction

Differential twinax cable modeling by measured 4-port S-parameters

Application of artificial neural network for efficient hardware characterization of high-speed interconnect systems

Using S-parameters successfully in time domain link simulations

Application of transmission line models to backpanel plated through-hole via design

A high-sensitivity active magnetic probe using CMOS integrated circuits technology

Discontinuity impacts and design considerations of high speed differential signals in FC-PBGA packages with high wiring density

Leveraging symbiotic on-die decoupling capacitance

A 2-dimensional distributed equivalent circuit model of EBG power distribution network

A new method to achieve improved accuracy with IBIS models

Models for pre-layout inductance estimation including frequency effects on current return path in advanced digital circuits

Understanding how to model difficult features and related physical effects in electrical packages

Nonlinear macromodeling using model order reduction

Frequency domain analysis of the multi-tap driver in high speed links

Towards a traveling wave power distribution module using micromachined packaging techniques for millimeter and submillimeter wave applications

Analysis and issues of developing a build-up laminate multi-chip-module

Transition structures for EBG waveguide-based interconnects

High frequency electrical circuit model of chip-to-chip vertical via interconnection for 3-D chip stacking package

Multi-Gb/s I/O link model to hardware correlation

Investigation of lead frame package interconnection for mm-wave balanced circuit

Evaluation and reduction of simulation error of chip-to-chip signal delay

Development of molded liquid crystal polymer surface mount packages for millimeter wave applications

Modeling and validation of complex midplane in a Blade environment

Methodology for on-package decoupling capacitor selection with considerations of coupled core and IO power delivery network and simultaneous switching noise effects

Efficient generation of reduced-order interconnect macromodels using RLCG MNA formulation

Analysis of system-level electromagnetic interference from electronic packages and boards

A finite-volume method for on-package IR drop characterization

Efficient passive macromodels for lossy multiconductor transmission lines using high order finite element method

A study of signal propagation in nonlinear interconnects

A three-stage preconditioner for geometries with multiple holes and handles in integral equation-based electromagnetic simulation of integrated packages

Data center server packaging technology

Methods of eye-pattern window improvement using reflections caused by impedance mismatch: post-emphasis technique

System-level BER test and jitter extraction of a 6.4Gbps parallel chip to chip bus on the first generation CELL/spl trade/ processor

Delay analysis using FDTD for source synchronous interfaces

Impact on inter symbol interference (ISI) noise due to simulation error

EMI analysis of the LCD panel considering the display driver IC operations

Improving the efficiency of passivity compensation schemes via adaptive sampling

Multi-level parametric model order reduction for interconnect networks

Scalable driver I/O macromodels for statistical analysis

A parallel multilevel low-rank decomposition algorithm for fast simulation of high-speed electronic interconnect and packages

Massively parallel conformal FDTD on a BlueGene supercomputer

A novel graph partitioning technique for enhancing the computational efficiency of the loop-tree generalized PEEC modeling of 3D interconnects

Power supply noise-aware 3D floorplanning for system-on-package

Complex power distribution network investigation using SPICE based extraction from first principle formulations

Voltage regulator module noise analysis for high-volume server applications

Mid frequency decoupling using embedded decoupling capacitors

On chip circuit model for accurate mid-frequency simultaneous switching noise prediction

The general variational formulas for capacitance parameter extraction

The use of accelerated full-wave modeling to analyze power island coupling in a HyperBGA SCM

Combined FDTD/FETD algorithm for ground bounce characterization of differential traces through the planes

A frequency expansion technique based on iterative solver and lump matrices

An efficient algorithm for generation of loop-tree basis in 2.5D interconnect models

The effect of power islands on delta-I noise, interconnect noise, and timing for wide, on-chip data-buses

Reducing the impact of power supply noise on microprocessor performance

CMOS ICs power-supply related decoupling properties

Differential current-mode signaling for robust and power efficient on-chip global interconnects

Simulation of switching noise in on-chip power distribution networks of FPGAs

On-chip bus interleaving revisited

Turbo-SPICE with latency insertion method (LIM)

Application of a dispersive hybrid phase-pole macromodel to the time-domain simulation of frequency-dependent lossy interconnects

Co-simulation of signal and power delivery networks with causality

Derivation of a network macromodel model with delay extraction for efficient time-domain simulation of lossy transmission lines

Surface-based finite element method for large-scale 3D circuit modeling

Solving low frequency EM-CKT problems using the PEEC method

Broadband electromagnetic analysis of interconnects by means of TLM and Krylov model order reduction

A low-frequency extension of the time-domain adaptive integral method

Surface current modelling of the skin effect

Crosstalk analysis by fast computational algorithms

Electrical Performance of Electronic Packaging

Electrical Performance of Electronic Packaging - 2004

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)

Electrical Performance of Electronic Packaging,

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524)

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)

IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370)

Electrical Performance of Electronic Packaging

Proceedings of Electrical Performance of Electronic Packaging

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging

Proceedings of IEEE Electrical Performance of Electronic Packaging

[1992 Proceedings] Electrical Performance of Electronic Packaging

Understanding how to model difficult features and related physical effects in electrical packages

Content Provider	IEEE Xplore Digital Library
Author	Rubin, B.J.
Copyright Year	2004
Description	Author affiliation: IBM Res. Div., T. J. Watson Res. Center, Yorktown Heights, NY, USA (Rubin, B.J.)
Abstract	We investigate and provide solutions for a number of features that are simple and occur frequently in electrical package analysis, yet are difficult to model accurately. We also describe physical effects where the results seem unusual and suspect, but actually are physically based. We consider the current spread from vias, apparent shielding ineffectiveness of ideal conductive enclosures, negative inductance in coupled line structures, situations where adding small valued decoupling capacitors actually increases noise, and gridding and convergence issues.
Sponsorship	IEEE Microwave Theory and Techniques Soc. IEEE Components, Packaging and Manufacturing Technol. Soc
Starting Page	127
Ending Page	130
File Size	742068
Page Count	4
File Format	PDF
ISBN	0780392205
DOI	10.1109/EPEP.2005.1563718
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-10-24
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Packaging Inductance Boundary conditions Capacitors Convergence Feeds Mutual coupling Circuits Bars
Content Type	Text
Resource Type	Article

Central Library (ISO-9001:2015 Certified)
Indian Institute of Technology Kharagpur
Kharagpur, West Bengal, India | PIN - 721302

See location in the Map
03222 282435
Mail: ndl-support@iitkgp.ac.in

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Mr. Siddhartha Mukherjee siddhartha@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	ndl-support@iitkgp.ac.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Libarray of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in