NDLI: Characterization and modeling of multiple coupled on-chip interconnects on silicon substrate

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Characterization and modeling of multiple coupled on-chip interconnects on silicon substrate

Content Provider	IEEE Xplore Digital Library
Author	Ji Zheng Tripathi, V.K. Weisshaar, A.
Copyright Year	2000
Description	Author affiliation: Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA (Ji Zheng)
Abstract	A quasi-static EM solver based on partial element equivalent circuits is applied to characterize multiple coupled microstrip on-chip interconnects on silicon. The EM solver takes into account the substrate skin effect as well as the conductor skin and proximity effects. Equivalent circuits consisting of only ideal passive elements are extracted from the EM data. Extraction results are presented for a coupled three-line interconnect structure.
Starting Page	333
Ending Page	336
File Size	352416
Page Count	4
File Format	PDF
ISBN	0780364503
DOI	10.1109/EPEP.2000.895557
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-10-23
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon Integrated circuit interconnections Conductors Coupling circuits Skin effect Inductance Equivalent circuits Proximity effect Frequency Microstrip
Content Type	Text
Resource Type	Article

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