NDLI: Picosecond time-domain photoconductive sampling method for measuring guided and free-space pulse propagation

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2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)

2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems

19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems

2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems

2008 IEEE-EPEP Electrical Performance of Electronic Packaging

2007 IEEE Electrical Performance of Electronic Packaging

2006 IEEE Electrical Performane of Electronic Packaging

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.

Electrical Performance of Electronic Packaging - 2004

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)

Electrical Performance of Electronic Packaging,

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524)

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)

Interconnect limits on gigascale integration

Electronic packaging for microwave multichip modules

Challenges in the packaging of an eight way server

Physical layer design of a 1.6 GB/s DRAM bus

Implementation considerations for RAMBUS/sup TM/-based systems

Noise verification across 3 levels of packaging hierarchy for the IBM G5/G6 mainframes

Noise measurements on Power4 Test chip

Half-conductive coupling for chip-to-chip connections

RF interconnect for multi-Gbit/sec board-level clock distribution

Operating frequency trends for high performance off-chip buses

On-chip wiring design challenges for GHz operation

Reliability and performance tradeoffs in the design of on-chip power delivery and interconnects

Impact of cross-over lines on delay time of two parallel global wires [IC interconnects]

Asymptotically zero power dissipation gigahertz clock distribution networks

Picosecond time-domain photoconductive sampling method for measuring guided and free-space pulse propagation

Limitations due to systematic phase errors on the extraction of loss tangent from micron-sized transmission line test structures

Parameter extraction for circuit models of electronic packages without optimization

Electrical characterization of S/390 MCM packages from S-parameter measurements below 3 GHz

Domain decomposition approach for capacitance computation of non-orthogonal interconnect structures

Improved global rational approximation macromodeling algorithm for transient simulation of interconnects

Application of subspace projection approaches for reduced-order modeling of electromagnetic systems

Numerical analysis of surface waves on a grounded dielectric plane using the finite difference time domain method

Modeling the effects of non-linear materials in de-coupling components of digital systems

Power distribution modeling and decoupling of multilayer printed circuit board

Electrical performance of buried capacitors in multi-layered PCBs

Precise chip and package 3D capacitance simulations of realistic interconnects using a general purpose FEM-tool

RF characterization of low cost MCM-D substrates, manufactured on large area panels

Validation of integrated capacitor-via-planes model

High performance socket characterization technique for microprocessors

Achieving 800 MT/s performance with PGA370 socket

An accurate and complete frequency dependent transmission line characterization using S-parameter measurements

Transmission link radiation: localized defect contribution

Power plane decoupling strategy for high speed processor boards

Simultaneous switching, noise, and reliability analyses of VLSI core logic

Modeling and transient simulation of planes in electronic packages for GHz systems

Accuracy considerations of power-ground plane models

Computation of the frequency response of multiple planes in gigahertz packages and boards

Simultaneous switch noise and power plane bounce for CMOS technology

Modeling of simultaneous switching output by equivalent source impedance

Off-chip delta-I noise modeling and measurement methodology

Design and performance evaluation of chip capacitors on microprocessor packaging

Characteristic impedance of microstrip on silicon

Equivalent circuit modeling of single and coupled on-chip interconnects on lossy silicon substrate

Enhanced skin effect for partial element equivalent circuit (PEEC) models

Study of meander line delay in circuit boards

Radiated emission from pin-fin heat sink mounted on an EBGA package

Methods to reduce radiation from split ground plane structures [packaging]

Distributed effects of a gap in power/ground planes

A novel time domain algorithm for field excited lossy transmission lines

An integrated environment for the simulation of electrical, thermal and electromagnetic interactions in high-performance integrated circuits

Toward a novel planar circuit compatible silicon micromachined waveguide

77 GHz band surface mountable ceramic package

Design rule development for microwave flip chip applications

High-performance silicon MMIC interconnect for millimeter wave wireless communication

Simulation of embedded RF circuits using macromodels and synthesized equivalent circuits

On the chicken-and-egg problem of determining the effect of crosstalk on delay in integrated circuits

Laguerre-SVD reduced order modeling

Latency insertion method for the fast simulation of interconnection networks

A fast simulation method for single and coupled lossy lines with frequency-dependent parameters based on triangle impulse responses

Efficient and accurate extraction of frequency-dependent resistance and inductance parameters of interconnects

IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370)

Electrical Performance of Electronic Packaging

Proceedings of Electrical Performance of Electronic Packaging

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging

Proceedings of IEEE Electrical Performance of Electronic Packaging

[1992 Proceedings] Electrical Performance of Electronic Packaging

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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