NDLI: BGA MPI socket analysis and validation

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BGA MPI socket analysis and validation

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BGA MPI socket analysis and validation

Content Provider	IEEE Xplore Digital Library
Author	Aldana, F.R. Zenteno, A. Mendavil, D.R. Regalado, G.
Copyright Year	2012
Description	Author affiliation: Intel Tecnologia de Mexico Guadalajara, Mexico (Aldana, F.R.; Zenteno, A.; Mendavil, D.R.; Regalado, G.)
Abstract	The design of a ball grid array metalized particle interconnect (BGA MPI) socket is presented. A novel design using static force system using less force and components instead of a dynamic one is shown. The performance of MPI socket has been characterized mechanically as deformation value and electrically as S parameters for different compression force. The MPI has been validated at laboratory using continuity, resistance and validation test. All of tests successfully passed which probed the socket design.
Starting Page	1
Ending Page	6
File Size	459517
Page Count	6
File Format	PDF
ISBN	9781457711169
e-ISBN	9781457711176
e-ISBN	9781457711152
DOI	10.1109/ICCDCS.2012.6188927
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-03-14
Publisher Place	Mexico
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Force Resistance Sockets Fasteners Electrical resistance measurement Insertion loss Capacitance finite element analysis Printed circuit board (PCB) MPI socket S-parameters continuity test resistance test
Content Type	Text
Resource Type	Article

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