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Author Bobba, Shashikanth ♦ Chakraborty, Ashutosh ♦ Thomas, Olivier ♦ Batude, Perrine ♦ Micheli, Giovanni de
Source ACM Digital Library
Content type Text
Publisher Association for Computing Machinery (ACM)
File Format PDF
Copyright Year ©2013
Language English
Subject Domain (in DDC) Computer science, information & general works ♦ Data processing & computer science
Subject Keyword 3D integration ♦ 3D monolithic ♦ Cell transformation techniques ♦ Layout
Abstract 3D Monolithic Integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. In 3DMI technology the 3D contacts, connecting different active layers, are in the order of few 100nm. Given the advantage of such small contacts, 3DMI enables fine-grain (gate-level) partitioning of circuits. In this work we present three cell transformation techniques for standard cell-based ICs with 3DMI technology. As a major contribution of this work, we propose a design flow comprising of a cell transformation technique, cell-on-cell stacking, and a physical design technique $(CELONCEL_{PD})$ aimed at placing cells transformed with $\textit{cell-on-cell}$ stacking. We analyze and compare various cell transformation techniques for 3DMI technology without disrupting the regularity of the IC design flow. Our experiments demonstrate the effectiveness of CELONCEL design technique, yielding us an area reduction of 37.5%, 16.2% average reduction in wirelength, and 6.2% average improvement in overall delay, compared with a 2D case when benchmarked across various designs in 45nm technology node.
ISSN 15504832
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2013-10-08
Publisher Place New York
e-ISSN 15504840
Journal ACM Journal on Emerging Technologies in Computing Systems (JETC)
Volume Number 9
Issue Number 3
Page Count 28
Starting Page 1
Ending Page 28


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Source: ACM Digital Library