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Author Xie, Yuan ♦ Loh, Gabriel H. ♦ Black, Bryan ♦ Bernstein, Kerry
Source ACM Digital Library
Content type Text
Publisher Association for Computing Machinery (ACM)
File Format PDF
Copyright Year ©2006
Language English
Subject Domain (in DDC) Computer science, information & general works ♦ Data processing & computer science
Subject Keyword 3D integration ♦ Hardware ♦ Microarchitecture ♦ Processor architectures
Abstract As technology scales, interconnects have become a major performance bottleneck and a major source of power consumption for microprocessors. Increasing interconnect costs make it necessary to consider alternate ways of building modern microprocessors. One promising option is 3D architectures where a stack of multiple device layers with direct vertical tunneling through them are put together on the same chip. As fabrication of 3D integrated circuits has become viable, developing CAD tools and architectural techniques is imperative to explore the design space to 3D microarchitectures. In this article, we give a brief introduction to 3D integration technology, discuss the EDA design tools that can enable the adoption of 3D ICs, and present the implementation of various microprocessor components using 3D technology. An industrial case study is presented as an initial attempt to design 3D microarchitectures.
ISSN 15504832
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2006-04-01
Publisher Place New York
e-ISSN 15504840
Journal ACM Journal on Emerging Technologies in Computing Systems (JETC)
Volume Number 2
Issue Number 2
Page Count 39
Starting Page 65
Ending Page 103


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Source: ACM Digital Library