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Author Duperrier, C. ♦ Campovecchio, M. ♦ Roussel, L. ♦ Lajugie, M. ♦ Quere, R.
Sponsorship IEEE Microwave Theory and Techniques Society
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1963
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Design methodology ♦ Power amplifiers ♦ Distributed amplifiers ♦ Semiconductor optical amplifiers ♦ High power amplifiers ♦ Manufacturing processes ♦ Semiconductor device manufacture ♦ Foundries ♦ PHEMTs ♦ Power generation
Abstract A new design methodology of uniform and nonuniform distributed power amplifiers is reported in this paper. This method is based on analytical expressions of the optimum input and output artificial lines making up the uniform and nonuniform distributed architectures. These relationships are derived from the load-line requirement of each transistor size for optimum power operation. Furthermore, specific design criteria are presented to enable an efficient choice between uniform and nonuniform distributed architectures. To validate this new design methodology, a nonuniform distributed power amplifier has been manufactured at the TriQuint Semiconductor Foundry, Richardson, TX, using a 0.25-/spl mu/m power pseudomorphic high electron-mobility process. This single-stage monolithic-microwave integrated-circuit amplifier is made of six nonuniform cells and demonstrates 1-W output power with 7-dB associated gain and 20% power-added efficiency over a multioctave bandwidth.
Description Author affiliation :: IRCOM, Limoges Univ., France
ISSN 00189480
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2001-12-01
Publisher Place U.S.A.
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Volume Number 49
Issue Number 12
Size (in Bytes) 223.79 kB
Page Count 7
Starting Page 2494
Ending Page 2500

Source: IEEE Xplore Digital Library