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Author Qiu, Wu jun ♦ Zhang, Sheng nan ♦ Zhu, Tie jun ♦ Zhao, Xin bing
Source SpringerLink
Content type Text
Publisher University of Science and Technology Beijing
File Format PDF
Copyright Year ©2010
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations
Subject Keyword thin films ♦ thermoelectric materials ♦ electrochemical deposition ♦ bismuth telluride ♦ basic electrolyte ♦ Tribology, Corrosion and Coatings ♦ Surfaces and Interfaces, Thin Films ♦ Ceramics, Glass, Composites, Natural Methods ♦ Characterization and Evaluation of Materials ♦ Metallic Materials ♦ Materials Science
Abstract A new basic electrolyte with two cationic plating additives, polydiaminourea and polyaminosulfone, was investigated for the electrochemical deposition of the bismuth telluride film on a nickel-plated copper foil. Tellurium starts to deposit at a higher potential (−0.35 V) than bismuth (−0.5 V) in this electrolyte. The tellurium-to-bismuth ratio increases while the deposition potential declines from −1 to −1.25 V, indicating a kinetically quicker bismuth deposition at higher potentials. The as-deposited film features good adhesion to the substrate and smooth morphology, and has a nearly amorphous crystal structure disclosed by X-ray diffraction patterns.
ISSN 16744799
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2010-07-28
Publisher Place Beijing
e-ISSN 1869103X
Journal International Journal of Minerals, Metallurgy, and Materials
Volume Number 17
Issue Number 4
Page Count 5
Starting Page 489
Ending Page 493


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Source: SpringerLink