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Author Murphy, P. ♦ Hubschi, K. ♦ De Rooij, N. ♦ Racine, C.
Sponsorship IEEE ♦ Waseda Univ ♦ Univ. Salford
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1965
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Silicon ♦ Electrets ♦ Capacitors ♦ Microphones ♦ Etching ♦ Preamplifiers ♦ FETs ♦ Impedance matching ♦ Hearing aids ♦ Chemical sensors
Abstract Microphones were prepared that use one silicon wafer to support a thin polyester diaphragm and a second to carry a Teflon or silicon dioxide electret. Subassemblies are diced from the wafer and bonded together to form complete microphones. The preamplifier circuit can be carried on either subassembly. Microphones with reasonable signal-to-noise ratios can be obtained with edge dimensions of 3 mm or less. The electroacoustic properties of prototype units are described.<<ETX>>
Description Author affiliation :: Lectret SA, Meyrin-Geneva, Switzerland
ISSN 00189367
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1989-06-01
Publisher Place U.S.A.
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Volume Number 24
Issue Number 3
Size (in Bytes) 323.07 kB
Page Count 4
Starting Page 495
Ending Page 498


Source: IEEE Xplore Digital Library