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Author Zhou, T. ♦ Hundt, M. ♦ Motta, V.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1996
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Thermal resistance ♦ Thermal management ♦ Copper ♦ Thermal conductivity ♦ Thermal factors ♦ Plastic packaging ♦ Computational fluid dynamics ♦ Microelectronics ♦ Electrical resistance measurement ♦ Temperature sensors
Abstract In this paper, thermal performance of Standard and power TQFP packages is investigated. CFD simulation is performed to study the effects of board and package construction, and power package copper slug direct attach to the board. Thermal paths are analyzed by viewing the heat dissipation percentage through package surfaces. The following conclusions can be made from this study: (1) For most plastic packages at a given power dissipation and cooling condition, the temperature drop from junction to board is only dependent on package construction. The temperature drop from board to ambient is a function of board construction. Junction to ambient thermal resistance can be obtained by superimposing the two parts. (2) In general, the dominant thermal path for plastic packages is conduction through leads to PCB. (3) The thermal resistance for the Power TQFP is 13/spl deg/C/W lower than that of the standard TQFP. (4) Power TQFP slug direct attach to the board reduces the thermal resistance by 45%. (5) Copper pad and thermal vias under the package will reduce the thermal resistance up to 2.7/spl deg/C/W (7%) for the Power TQFP. Using smaller package stand off results in 5/spl deg/C/W (13%) thermal resistance reduction.
Description Author affiliation: Corp. Package Dev., SGS-Thomson Microelectron. Inc., Carrollton, TX, USA (Zhou, T.; Hundt, M.)
ISBN 0780331397
ISSN 10652221
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1996-03-05
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 665.01 kB
Page Count 11
Starting Page 19
Ending Page 29

Source: IEEE Xplore Digital Library