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Author Wu, M.-F. ♦ Pan, H.-C. ♦ Wang, T.-H. ♦ Huang, J.-L. ♦ Kun-Han Tsai ♦ Wu-Tung Cheng
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2010
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations
Subject Keyword Logic testing ♦ Test pattern generators ♦ Timing ♦ Circuit testing ♦ Automatic test pattern generation ♦ Power supplies ♦ Lab-on-a-chip ♦ Thermal management ♦ Heat sinks ♦ Heat transfer
Abstract For two-pattern at-speed scan testing, the excessive power supply noise at the launch cycle may cause the circuit under test to malfunction, leading to yield loss. This paper proposes a new weight assignment scheme for logic switching activity; it enhances the IR-drop assessment capability of the existing weighted switching activity (WSA) model. By including the power grid network structure information, the proposed weight assignment better reflects the regional IR-drop impact of each switching event. For ATPG, such comprehensive information is crucial in determining whether a switching event burdens the IR-drop effect. Simulation results show that, compared with previous weight assignment schemes, the estimated regional IR-drop profiles better correlate with those generated by commercial tools.
Description Author affiliation: Mentor Graphics Corporation, 8005 SW Boeckman Road, Wilsonville, OR 97070, USA (Kun-Han Tsai; Wu-Tung Cheng) || Graduate Institute of Electronics Engineering, Dept. of Electrical Engineering, National Taiwan University, Taipei 106, Taiwan (Wu, M.-F.; Pan, H.-C.; Wang, T.-H.; Huang, J.-L.)
ISBN 9781424457656
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2010-01-18
Publisher Place Taiwan
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 1.49 MB
Page Count 6
Starting Page 493
Ending Page 498


Source: IEEE Xplore Digital Library