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Author Jha, V. ♦ Hauck, T.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2014
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Substrates ♦ Electronic packaging thermal management ♦ Thermal management ♦ Thermal resistance ♦ Junctions ♦ Copper ♦ Thermal force ♦ substrate ECAD model ♦ thermal management of electronic packages
Abstract With requirements of higher power density and smaller package size, thermal management of electronic packages has become increasingly challenging since last decade. With several design parameters playing an important role in evaluation of thermal characterization parameter, design approximations can lead to significant error. Substrate design is a critical aspect of the thermal model and the current state-of-the-art varies from approximate copper percentage inclusions to manually building traces to capture important geometrical features. Typically, these methods are prone to approximation errors and are also time consuming for building geometric models. An alternate method proposed is to use direct substrate ECAD integration in the package model that significantly improves the thermal modeling efficiency.
Description Author affiliation: Freescale Semicond., Austin, TX, USA (Jha, V.; Hauck, T.)
ISBN 9781479952670
ISSN 10879870
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2014-05-27
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 634.23 kB
Page Count 4
Starting Page 1007
Ending Page 1010

Source: IEEE Xplore Digital Library