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Author Tamura, A. ♦ Yamashita, T. ♦ Matsui, H. ♦ Matsuzaki, K. ♦ Hayashi, T.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2007
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Contamination ♦ Force control ♦ Thermal force ♦ Adhesives ♦ Semiconductor devices ♦ Size control ♦ Heating ♦ Temperature ♦ Semiconductor device modeling ♦ Predictive models
Abstract As the miniaturization of semiconductor devices increases, the size of contamination particles that must be controlled becomes smaller. The effects of diffusion are stronger for smaller particles, so control becomes more difficult. We therefore evaluated the use of thermophoretic force in a new control technique. We confirmed that particle adhesion could be mostly prevented by simply heating the wafer to 5degC above the temperature of the air flow. Furthermore, we established a model of adhesion prevention behavior which predicts that the adhesion prevention effect of thermophoretic force is adequate, even for particles less than 40 nm in diameter. In addition, we actually confirmed that thermophoresis prevents adhesion even for 20 nm PSL particles.
Description Author affiliation: Tokyo Electron LTD, Yamanashi (Tamura, A.; Yamashita, T.; Matsui, H.; Matsuzaki, K.; Hayashi, T.)
ISBN 9781424411412
ISSN 1523553X
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2007-10-15
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 1.38 MB
Page Count 4
Starting Page 1
Ending Page 4


Source: IEEE Xplore Digital Library