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Author Ravikumar, C.P. ♦ Prasad, N.S.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1998
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Built-in self-test ♦ Power dissipation ♦ Circuit testing ♦ Power engineering and energy ♦ Packaging ♦ Hamming distance ♦ Switching circuits ♦ Circuit faults ♦ Automatic testing ♦ Heating
Abstract The "system-on-chip" revolution has posed a number of new challenges to the test engineers. We address the issue of high power dissipation during testing, which can reach levels that are beyond the safe upper limit associated with the chosen packaging technology. A study undertaken by Zorian (1993) reveals that test power can be as large as 200% or more in comparison to the normal power. In the test mode, input vectors are normally applied in an uncorrelated manner, leading to an increase in the average Hamming distance between two successive vectors. This implies a larger switching activity, and, for CMOS circuits, implies a larger power dissipation. In this paper, our attempt is to look at Built-in Self-Test (BIST) architectures from the view point of power dissipation, fault-coverage, area, and test length. We report experimental results for a CORDIC chip. Our results indicate that BIST architectures differ significantly from one another in terms of power dissipation, giving the test designer an opportunity to address the problem of excessive heating during testing.
Description Author affiliation: Dept. of Electr. Eng., Indian Inst. of Technol., New Delhi, India (Ravikumar, C.P.)
ISBN 0818682779
ISSN 10817735
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1998-12-02
Publisher Place Singapore
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 465.63 kB
Page Count 5
Starting Page 430
Ending Page 434


Source: IEEE Xplore Digital Library