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Author Prapavessi, D.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2006
Language English
Subject Domain (in DDC) Social sciences ♦ Education ♦ Technology ♦ Engineering & allied operations
Subject Keyword Calculus ♦ Educational institutions ♦ Collaborative work ♦ Education ♦ Java ♦ Mathematics ♦ Page description languages ♦ Differential equations ♦ Collaboration ♦ Educational programs ♦ Wireless Tablet technology ♦ Calculus curriculum ♦ Experiential learning ♦ Impact of technology
Abstract This paper studies the impact of infusing the Calculus II curriculum at Diablo Valley College with collaborative activities based on wireless tablet technology. Under a 2005 HP Technology for Teaching grant, students used Tablets to record and analyze data collected in labs, access Web based Mathematica notebooks and Java applets, collaborate, give class presentations, and report on field trips to organizations that use Calculus in their practices. Many students at the college come from underrepresented socioeconomic groups. These new learning experiences ignited their interest in the subject matter and helped them get a better focus for their studies. In the classes taught with the redesign a 98% attendance rate was observed, along with an 86% retention (up from ~75%) and a 78% success rate (up from ~69%). Student involvement increased significantly and at least 17% of the students improved their performance by 1-2 letter grades after the introduction of the technology
Description Author affiliation: Dept. of Math., Diablo Valley Coll., Pleasant Hill, CA (Prapavessi, D.)
ISBN 1424402565
ISSN 01905848
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2006-10-27
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 166.17 kB
Page Count 2
Starting Page 6
Ending Page 7


Source: IEEE Xplore Digital Library