Thumbnail
Access Restriction
Subscribed

Author Yeh, L.T.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1990
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Space cooling ♦ Heat transfer ♦ Electronics cooling ♦ Surface resistance ♦ Electronic equipment ♦ System performance ♦ Contact resistance ♦ Instruments ♦ Temperature distribution ♦ Temperature control
Abstract Consideration is given to a array consisting of a number of identical electronic modules. The modules are arranged into many rows, and each row includes a number of modules (18 modules in the present case). Each module dissipates 14 W. To reduce the maximum temperature and temperature variation over the array, several cooling schemes are investigated: (1) a single, unidirectional flow; (2) a side-by-side, bidirectional flow, and (3) a top-to-bottom, bidirectional flow. Numerical examples are used to demonstrate the features of each approach. It is found that the top-to-bottom, bidirectional flow system is the most effective cooling method in maintaining low temperature and the small temperature differences of the system. For a given flow rate, the effect of the unequal channel flow on the temperature distribution is also discussed.
Description Author affiliation: Texas Instruments Inc., Plano, TX, USA (Yeh, L.T.)
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1990-05-23
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 455.75 kB
Page Count 7
Starting Page 113
Ending Page 119


Source: IEEE Xplore Digital Library