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Author Watanabe, T.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1996
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations
Subject Keyword Wiring ♦ Routing ♦ Wires ♦ Circuits ♦ Compaction ♦ Workstations ♦ Design engineering ♦ Systems engineering and theory ♦ Resistors ♦ Capacitors
Abstract The purpose of the paper is to outline MULTI-PRIDE, a system for supporting multi-layered printed wiring board design. It consists of (i) circuit bipartition, (ii) placement and routing on each outside layer, (iii) modification of wiring and compaction, and (iv) routing on inside layers.
Description Author affiliation: Fac. of Eng., Hiroshima Univ., Japan (Watanabe, T.)
ISBN 0780336623
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1997-01-28
Publisher Place Japan
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 658.25 kB
Page Count 6
Starting Page 221
Ending Page 226


Source: IEEE Xplore Digital Library