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Author Phong Ooi Lin ♦ Ang Ghim Boon ♦ Chua Kok Keng ♦ Oh Chong Khiam ♦ Lo Keng Foo
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2004
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Spectroscopy ♦ Energy loss ♦ Failure analysis ♦ Fabrication ♦ Scanning electron microscopy ♦ Transmission electron microscopy ♦ Performance analysis ♦ Textile industry ♦ Resists ♦ Photonic crystals
Abstract In this paper, a case study on the failure analysis and yield enhancement on poly grooves/divots in wafer fabrication was investigated and studied. Several failure analysis techniques and tools such as SEM, Auger electron spectroscopy (AES) and transmission electron microscopy electron energy loss spectrum (TEM EELS) were used in the course of the failure analysis to understand the root cause/mechanism relating to poly groove issues. The poly grooves occurred on the interface of the P+/N+ poly was due to missing oxide as a result of the resist not removed and caused chemical attack in the subsequent spacer etch.
Description Author affiliation: Chartered Semicond. Mfg. Ltd., Singapore, Singapore (Phong Ooi Lin; Ang Ghim Boon; Chua Kok Keng; Oh Chong Khiam; Lo Keng Foo)
ISBN 0780386582
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2004-12-07
Publisher Place Malaysia
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 2.97 MB


Source: IEEE Xplore Digital Library