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Author Haque, S. ♦ Xing, K. ♦ Suchicital, C. ♦ Nelson, D.J. ♦ Lu, G.-Q. ♦ Borojevic, D. ♦ Lee, F.C.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1998
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Electronic packaging thermal management ♦ Thermal management ♦ Thermal management of electronics ♦ Semiconductor device packaging ♦ Power electronics ♦ Space heating ♦ Packaging machines ♦ Integrated circuit interconnections ♦ Copper ♦ Costs
Abstract The Virginia Power Electronics Center at Virginia Tech has developed a low cost approach for packaging of power electronics building blocks (PEBB) consisting of power semiconductor devices, drivers, controls, sensors and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. The new concept of PEBB packaging, termed metal posts interconnected parallel plate structure (MPIPPS), is based on direct bonding of copper posts to interconnect power devices, thus eliminating wire-bonding with aluminum wires. The interior space between the parallel plates and copper posts can be used as a flow channel for heat dissipation by a dielectric fluid, or filled with a solid or liquid for additional heat spreading. This approach requires less expensive processing equipment and has the potential to produce cost-effective high power modules that have superior electrical, thermal, and mechanical performance. This paper presents the materials selection and fabrication techniques developed in the course of the research and initial electrical and thermal characterization of the MPIPPS structure.
Description Author affiliation: Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA (Haque, S.)
ISBN 0780344863
ISSN 10652221
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1998-03-10
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 1.01 MB
Page Count 9
Starting Page 111
Ending Page 119

Source: IEEE Xplore Digital Library