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Author Vick, B. ♦ Nelson, D.J.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1990
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Temperature ♦ Magnetic heads ♦ Green's function methods ♦ Heat transfer ♦ Thermal conductivity ♦ Friction ♦ Boundary element methods ♦ Magnetic flux ♦ Disk drives ♦ Rails
Abstract The temperatures produced by friction between a head and disk in sliding contact are investigated using a boundary-element method. The method solves for the transient and spatial variation of the division of frictional heat between the stationary and moving regions, and the resulting temperature distribution throughout both regions. A unique aspect is the use of a moving Green's function as opposed to a stationary, diffusion Green's function used in standard boundary-element methods. This moving Green's function is particularly well suited to this class of problems since it incorporates the convective effect of the moving region in a convenient and accurate manner. The method handles any arbitrary sliding velocity without numerical oscillations encountered at high Peclet numbers using other methods. The method is applied to a simplified model of a head-disk interface. The results for asperity contacts between semi-infinite regions show the influence of arterial thermal properties, sliding velocity or Peclet number, interaction between contact patches, and area of contact on the division of frictional heat between the stationary head and moving disk as well as the interface temperature.
Description Author affiliation: Dept. of Mech Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA (Vick, B.; Nelson, D.J.)
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1990-05-23
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 613.77 kB
Page Count 9
Starting Page 121
Ending Page 129

Source: IEEE Xplore Digital Library