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Author Li, R.S.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1998
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Thermal resistance ♦ Design optimization ♦ Analytical models ♦ Electronic packaging thermal management ♦ Integrated circuit interconnections ♦ Thermal conductivity ♦ Electric resistance ♦ Guidelines ♦ Resistance heating ♦ Assembly
Abstract In dealing with thermal via design, this paper presents a simple analytical model that provides an efficient approach for analysis of thermal via pads. Small vias close to one another form a cluster with a relatively large dimension. Heat flow across the substrate thickness in the via cluster is much more significant than the heat spreading effect in the lateral direction. Therefore, predominantly one-dimensional heat conduction allows analytical simplification by modeling the thermal via as parallel networks. Through single and multiple via modeling, an analytical relationship of thermal resistance versus the via design parameters is found and presented in dimensionless form. The via design parameters include hole diameter, pitch, plating thickness, and the void level of the filled materials inside the vias. Optimization of the design parameters is obtained using thermal resistance as the objective function. The analytical results were correlated with an FEA model and can be used as thermal via design guidelines in electronics packaging.
Description Author affiliation: Motorola Inc., Northbrook, IL, USA (Li, R.S.)
ISBN 0780344758
ISSN 10899870
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1998-05-27
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 556.18 kB
Page Count 6
Starting Page 475
Ending Page 480

Source: IEEE Xplore Digital Library