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Author Avramescu, V. ♦ Hjort, K.
Sponsorship IEEE-Electron Devices Soc.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2001
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Epitaxial layers ♦ Transistors ♦ Tin ♦ Soldering ♦ Microassembly ♦ Temperature ♦ Bonding ♦ Inorganic materials ♦ Semiconductor materials ♦ Gold
Abstract Hard solders have been used for over 35 years for high reliable die attach and include eutectic alloys of Au-Si, Au-Ge and Au-Sn, which have melting temperature of 383/spl deg/C, 361/spl deg/C and 280/spl deg/C respectively. This work presents a bonding technique that involves the use of a thin Sn layer (< /spl mu/m) as a soldering material between two surfaces having thin Au metallization. The technique has been applied for the integration of an epitaxial layer thin film A/sub III/B/sub V/ semiconductor device into a silicon coplanar waveguide technology suitable for high frequency applications.
Description Author affiliation: Nat. R&D Inst. in Microtechnologies, Bucharest, Romania (Avramescu, V.)
ISBN 0780366662
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2001-10-09
Publisher Place Romania
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 540.02 kB
Page Count 4
Starting Page 395
Ending Page 398


Source: IEEE Xplore Digital Library