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Author Aoki, H. ♦ Shioya, N. ♦ Ikeda, M. ♦ Kimura, Y.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2010
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Heat transfer ♦ Space heating ♦ Water heating ♦ Thermal resistance ♦ Resistance heating ♦ Thermal force ♦ Temperature ♦ Thermal loading ♦ Copper ♦ Containers ♦ Thermal Resistance ♦ Thin Heat Pipe ♦ Mesh Wick Structure ♦ Capillary Pressure ♦ Pressure Drop ♦ Capillary Force Limit ♦ Maximum Heat Transfer Capacity
Abstract Authors are reporting development of ultra thin heat pipe and its performance. The ultra thin heat pipe has thickness less than 1.0 mm and high capability of maximum heat transfer capacity, so that this heat pipe can be installed for narrow space, in which it have been difficult to apply the plate heat pipe so far, of the ultra compact information equipment such as Net Book PC. In this ultra thin heat pipe, the mesh wick which was conducted oxidation-reduction process in high temperature was used in order to obtain sufficient capillary pressure for circulation of the working fluid. The ultra thin heat pipe consists of this mesh wick and the copper container which has thin wall. This structure ensures both sufficient capillary pressure and space of vapor flow. Two kinds of the ultra thin heat pipe were made; one was 1.0 mm thickness and the other was 0.7 mm thickness. These heat pipes had high maximum heat transfer capacity comparing with conventional groove heat pipe. In this paper, we proposed the ultra thin heat pipe which consists of high capillary pressure wick, and experimental investigation is discussed.
Description Author affiliation: Furukawa Electr. Co., Ltd., Hiratsuka, Japan (Aoki, H.; Shioya, N.; Ikeda, M.; Kimura, Y.)
ISBN 9781424494583
ISSN 10652221
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2010-02-21
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
e-ISBN 9781424494606
Size (in Bytes) 412.08 kB
Page Count 6
Starting Page 217
Ending Page 222

Source: IEEE Xplore Digital Library