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Author Tomura, M. ♦ Chi-Hsein Huang ♦ Samukawa, S. ♦ Yoshida, Y. ♦ Ono, T. ♦ Yamasaki, S.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2010
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Plasmas ♦ Radiation effects ♦ Q factor ♦ Silicon ♦ Fabrication ♦ Measurement by laser beam ♦ Resonant frequency
Abstract We investigated the influences of the defects generated by plasma on a silicon (Si) microcantilever. The E' center density of the microcantilever was drastically increased after Ar plasma irradiation. The mechanical characteristics, including resonant frequency (ƒ) and the mechanical quality (Q) factor of a microcantilever were drastically decreased by plasma irradiation, which revealed that plasma irradiation deteriorated the mechanical characteristics of the micro element. Our results revealed that deterioration of ƒ and Q factor depended on Young's modulus of microcantilevers and the ratio of defect depth to microcantilevers thickness respectively. Furthermore, These results showed considerable impact on Micro- and Nano-Electro-Mechanical Systems.
Description Author affiliation: Energy Technology Research Institute, National Institute of Advanced Industrial Science and Technology, Tsukuba, Ibaraki, Japan (Yamasaki, S.) || Institute of Fluid Science, Tohoku University, Sendai, Miyagi, Japan (Tomura, M.; Chi-Hsein Huang; Samukawa, S.) || Graduate School of Engineering, Tohoku University, Sendai, Miyagi, Japan (Yoshida, Y.; Ono, T.)
ISBN 9781424481705
ISSN 19300395
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2010-11-01
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
e-ISBN 9781424481699
Size (in Bytes) 718.27 kB
Page Count 4
Starting Page 2534
Ending Page 2537


Source: IEEE Xplore Digital Library