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Author Mustafa, M. ♦ Zijie Cai ♦ Roberts, J.C. ♦ Suhling, J.C. ♦ Lall, P.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2012
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Aging ♦ Strain ♦ Stress ♦ Fatigue ♦ Temperature measurement ♦ Metals ♦ Cooling
Abstract The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work, we have demonstrated that the observed material behavior variations of Sn-Ag-Cu (SAC) lead free solders during elevated temperature aging were unexpectedly large and universally detrimental to reliability. Solder joints in electronic assemblies are typically subjected to thermal cycling, either in actual application or in accelerated life testing used for qualification. Mismatches in the thermal expansion coefficients of the assembly materials leads to the solder joints being subjected to cyclic (positive/negative) mechanical strains and stresses. This cyclic loading leads to thermomechanical fatigue damage that involves damage accumulation, crack initiation, crack propagation, and failure. While the effects of aging on solder constitutive behavior (stress-strain and creep) have been recently examined in some detail, there have been no prior studies on the effects of aging on solder failure and fatigue behavior.
Description Author affiliation: Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3), Auburn University, AL 36849, USA (Mustafa, M.; Zijie Cai; Roberts, J.C.; Suhling, J.C.; Lall, P.)
ISBN 9781424495337
ISSN 10879870
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2012-05-30
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
e-ISBN 9781424495320
Size (in Bytes) 4.94 MB
Page Count 16
Starting Page 765
Ending Page 780

Source: IEEE Xplore Digital Library