Access Restriction

Author Lei Dong ♦ Li-Feng Wang ♦ Qing-Ying Ren ♦ Qing-An Huang
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2014
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Inductors ♦ Temperature sensors ♦ Humidity ♦ Resonant frequency ♦ Temperature measurement ♦ Wireless sensor networks ♦ multi-parameter ♦ passive wireless sensor ♦ coaxially aligned ♦ inductor
Abstract In an LC-type passive wireless sensor system for multi-parameter monitoring, it is desirable for the inductors to be coaxially aligned stacked in order to save area. However, the transmitting signals affect each other due to mutual coupling between the stacked inductors. This paper presents a novel structure of inductor which is in a specific winding to achieve the minimized mutual inductance. Simulation results of three stacked inductors each connected with a variable capacitor indicate that the mutual inductance between the inductors can actually be greatly suppressed. This phenomenon has also been verified through multi-layer PCB inductors. Three capacitive sensors for temperature, pressure and relative humidity were linked to the three stacked inductors to implement the simultaneous measurements of humidity, temperature and pressure. The measurement results indicate that the sensitivity of the humidity sensor is about 53.33 kHz/%RH between 15%RH to 90%RH, the sensitivity of the temperature sensor is about 41.67 kHz/°C between -20°C to 100°C while the sensitivity of the pressure sensor is about -133.33 kHz/kPa between 50kPa to 110 kPa.
Description Author affiliation: Key Lab. of MEMS of the Minist. of Educ., Southeast Univ., Nanjing, China (Lei Dong; Li-Feng Wang; Qing-Ying Ren; Qing-An Huang)
ISBN 9781479901623
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2014-11-02
Publisher Place Spain
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 935.24 kB
Page Count 4
Starting Page 926
Ending Page 929

Source: IEEE Xplore Digital Library