Access Restriction

Author Kwon, S.C. ♦ Nam, K.S. ♦ Lee, G.H. ♦ Kim, J.K. ♦ Kim, M. ♦ Rha, J.J.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2003
Language English
Subject Domain (in DDC) Technology
Subject Keyword Plasma properties ♦ Mechanical factors ♦ Chromium ♦ Plasma immersion ion implantation ♦ Plasma sources ♦ Plasma applications ♦ Nitrogen ♦ Ion implantation ♦ Coatings ♦ Immune system
Abstract The investigation was undertaken by nitrogen plasma source ion implantation and pulsed plasma nitriding process to develop the novel process as an alternative to hexavalent chromium electroplating. The surface modification of the chromium electrodeposited from trivalent bath was conducted and the comparison of the surface property with hexavalent chromium electrodeposited was made in view of hardness. The surface hardening was achieved by both of processes. Characterization of the surfaces indicated the formation of hard compound layer of chromium-nitride. The improvements in hardness as a result of nitrogen plasma would be compared with interpolated trends from data reported. The possibility of the application of the plasma-added trivalent chromium process could be reviewed as one of hexavalent chromium replacement.
Description Author affiliation: Dept. of Surface Eng., IOM/KIMM, Kyungnam-Do, South Korea (Kwon, S.C.; Nam, K.S.; Lee, G.H.; Kim, J.K.; Kim, M.; Rha, J.J.)
ISBN 8978686176
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2003-06-28
Publisher Place South Korea
Rights Holder 7th Korea-Russia Intl Sym on Science
Size (in Bytes) 257.75 kB
Page Count 5
Starting Page 86
Ending Page 90

Source: IEEE Xplore Digital Library