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Author Xue Jie ♦ Zhang Zhengang
Sponsorship IEEE Comput. Soc. ♦ South China Univ. of Technol
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2006
Language English
Subject Domain (in DDC) Computer science, information & general works ♦ Data processing & computer science
Subject Keyword Business communication ♦ Technological innovation ♦ Containers ♦ Communications technology ♦ Knowledge management ♦ Computer networks ♦ Internet ♦ Knowledge transfer ♦ Information analysis
Abstract This paper does research on the application of the information and communication technologies to the knowledge transfer process in regional innovation system. Firstly, we analyze the characteristics of the knowledge in regional innovation system that involves the analysis of the nature of knowledge, the classification of the knowledge, the knowledge transfer process and the SECI model of knowledge transformation in regional innovation system. Secondly, the paper investigates the benefits derived from the application of information and communication technologies to regional innovation system. At last, we bring forward the ideas to apply the information and communication technologies to knowledge transfer process in regional innovation system and put forward the implementing strategies accordingly, which include the application of the information and communication technologies to the SECI model and the construction of the integrated regional knowledge management system
Description Author affiliation: Sch. of Bus. Adm., South China Univ. of Technol. (Xue Jie; Zhang Zhengang)
ISBN 0769527515
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2006-12-12
Publisher Place China
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 252.53 kB
Page Count 8
Starting Page 138
Ending Page 145


Source: IEEE Xplore Digital Library