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Author Morcos, M.M. ♦ Ward, S.A. ♦ Anis, H.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1998
Language English
Subject Keyword Contamination ♦ Geographic Information Systems ♦ Partial discharges ♦ Gas insulation ♦ Substations ♦ Hazards ♦ Dielectrics and electrical insulation ♦ Manufacturing ♦ Electrostatics ♦ Conducting materials
Abstract Metallic particles drastically impair the insulation integrity of compressed gas insulated substation (GIS) equipment. Such particles present a special hazard when in close proximity of support insulators. For GIS equipment to be reliable and economic, the problem of particle contamination should be overcome. Most GIS equipment manufacturers employ a variety of techniques and devices, such as electrostatic particle traps, to control metallic particle contamination. Conductors in gas-insulated systems may be coated with a dielectric material to restore some of the dielectric strength of the compressed gas that is lost due to surface roughness and contamination with conducting particles. Free metallic particles are a major cause of partial discharge (PD) in GIS. Several methods have been used in checking for PD activity. Recent diagnostic techniques include VHF and UHF-band PD detecting systems and ultrasonic vibration detecting systems. The methods used for the detection of pre-discharge caused by contaminating particles in GIS and the means of using this detection as a diagnostic tool for particle contamination are presented.
Description Author affiliation: Kansas State Univ., Manhattan, KS, USA (Morcos, M.M.)
ISBN 0780350359
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1998-10-25
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 459.62 kB
Page Count 5
Starting Page 476
Ending Page 480

Source: IEEE Xplore Digital Library