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Author Dori, Dov
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2007
Language English
Subject Domain (in DDC) Computer science, information & general works ♦ Computer programming, programs & data ♦ Technology ♦ Engineering & allied operations
Subject Keyword Heart ♦ Logic programming ♦ Object oriented modeling ♦ Unified modeling language ♦ Service oriented architecture ♦ Computer architecture ♦ Software systems ♦ Animation ♦ Application software ♦ Functional programming
Abstract Two software system lifecycle development paradigms have been competing on the minds and hearts of software developers and executives: The traditional Object-Oriented approach and the emerging Service-Oriented Architecture (SOA) or SO Development of Application (SODA). While OO puts objects and their encapsulated behavior at the center stage, emphasizing primarily rigid structure, SODA hails services as the prime players to cater primarily to behavior. We discuss the new SOA technologies from the extended enterprise and the service network all the way to the atomic service level and show that Object- Process Methodology (OPM), which strikes a unique balance between structure and behavior, is most suitable as the underlying SOA-based lifecycle engineering approach. Using OPCAT, the OPMsupporting systems modeling software environment, we construct the top level diagram of a model of SODA and simulate it using animation in order to show how OPM conveniently serves as an ideal overarching comprehensive methodology that encompasses the entire spectrum of service-oriented enterprise systems development.
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2007-10-30
Publisher Place Israel
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 531.73 kB
Page Count 10
Starting Page 147
Ending Page 156

Source: IEEE Xplore Digital Library