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Author Jae Sung Kim ♦ Ki-Young Kwak ♦ Kwang-Ho Kwon ♦ Nam-Ki Min ♦ Moon-Sik Kang
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2008
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Humidity ♦ Polyimides ♦ Sensor phenomena and characterization ♦ Thin film sensors ♦ Capacitive sensors ♦ Micromechanical devices ♦ Infrared spectra ♦ Temperature sensors ♦ Transistors ♦ Ovens
Abstract A novel capacitive-type humidity sensor based on polyimide thin films locally cured using MEMS microhotplate was developed. The locally cured polyimide films have been characterized using infrared spectroscopy and compared to those of films cured using a conventional thermal process. The polyimide locally cured at temperature over 350degC for 1 hour was fully cured. There were no significant differences in the polyimide thin films between locally cured on microhotplate and cured in convection ovens. The measured sensitivity for a sensor with a 1400 aring-thick polyimide film is 0.78 pF/%RH. Measurements show an offset drift of less than 1% RH at 50% RH and 37degC, and a hysteresis of <0.6%RH over a range of 25-85% RH, and a time response of 2.5 s. These results can be attributed to both locally-cured polyimide and sensor design and show the possibility of locally-cured polyimide films as high-speed, high-sensitivity humidity sensors.
Description Author affiliation: Dept. of Biomicrosyst. Technol., Korea Univ., Seoul (Moon-Sik Kang) || Dept. of Control & Instrum. Eng., Korea Univ., Jochiwon (Jae Sung Kim; Ki-Young Kwak; Kwang-Ho Kwon; Nam-Ki Min)
ISBN 9781424425808
ISSN 19300395
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2008-10-26
Publisher Place Italy
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 560.95 kB
Page Count 4
Starting Page 434
Ending Page 437

Source: IEEE Xplore Digital Library