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Author Jimenez, L.O. ♦ O'Neill-Carrillo, E. ♦ Frey, W. ♦ Rodriguez-Solis, R. ♦ Irizarry-Rivera, A. ♦ Hunt, S.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2006
Language English
Subject Domain (in DDC) Social sciences ♦ Education ♦ Technology ♦ Engineering & allied operations
Subject Keyword Design engineering ♦ Educational technology ♦ Social implications of technology ♦ Ethics ♦ Computer science education ♦ Power engineering and energy ♦ Signal design ♦ Digital signal processing ♦ Power systems ♦ Electromagnetics ♦ Capstone Course ♦ ABET ♦ Engineering Ethics ♦ Engineering Design ♦ Ethics Across the Curriculum
Abstract The School of Engineering at the University of Puerto Rico-Mayaguez (UPRM), has developed a module to integrate ethics into capstone design courses in the Electrical and Computer Engineering (ECE) Department. This module entitled, "Social and Ethical Implications of Engineering Design", helps students to reflect on issues and challenges associated with technological education that include (i) professional integrity, (ii) engineering, industry and social responsibility, and (iii) technological impact, societal and global awareness. This paper will describe this module and show how it has been implemented in ECE design courses in digital signal processing, power systems, applied electromagnetics, and electrical systems design. It also discusses student response by reporting student-based assessment results
Description Author affiliation: Dept. of Electr. & Comput. Eng., Puerto Rico Univ., Mayaguez (Jimenez, L.O.; O'Neill-Carrillo, E.)
ISBN 1424402565
ISSN 01905848
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2006-10-27
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 292.76 kB
Page Count 6
Starting Page 1
Ending Page 6

Source: IEEE Xplore Digital Library