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Author Jablonski, S. ♦ Reinwald, B. ♦ Ruf, T. ♦ Wedekind, H.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1990
Language English
Subject Domain (in DDC) Technology ♦ Manufacturing
Subject Keyword Manufacturing systems ♦ Resource management ♦ Computer integrated manufacturing ♦ Computer aided manufacturing ♦ Control systems ♦ Manufacturing automation ♦ Pulp manufacturing ♦ Flexible manufacturing systems ♦ Materials requirements planning ♦ Production systems
Abstract Recent efforts in integrating the various subtasks in computer-integrated manufacturing (CIM) show major weaknesses with regard to flexibility and reactivity. One reason is that, in current approaches to CIM, the main attention is given to automation and integration. The question of the potential and actual flexibility and reactivity that may be achieved when coupling the underlying subsystems-such as CAD, CAP, MRP, and CAM-in an appropriate manner is only considered in a second step. On the other hand, the goal of achieving a flexible and reactive CIM control system has to be looked at from the beginning when facing the task of making the CIM subsystems work together. The authors discuss an approach where the functionality provided by the different subsystems is exploited to a maximum degree without affecting the subsystems in their data or control structures. Instead, a supplementary layer approach is proposed which covers both the data and the control level integration of a CIM control system.
Description Author affiliation: Dept. of Comput. Sci., Erlangen Univ., West Germany (Jablonski, S.; Reinwald, B.; Ruf, T.; Wedekind, H.)
ISBN 0818690275
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1990-04-23
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 679.31 kB
Page Count 7
Starting Page 503
Ending Page 509


Source: IEEE Xplore Digital Library