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Author Mangyou, H. ♦ Watanabe, N. ♦ Hattori, K. ♦ Watanabe, T. ♦ Sugimori, Y. ♦ Shibuya, K. ♦ Hasaka, S.
Sponsorship IEEE Electron Devices Soc. ♦ IEEE Components Packaging and Manuf. Technol. Soc., Semicond. Equip. & Mater. Int. (SEMI) ♦ Soc. of Appl. Phys. of Japan
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2005
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Plasma applications ♦ Electronics industry ♦ Plasma waves ♦ Etching ♦ Cleaning ♦ Costs ♦ High power microwave generation ♦ Electromagnetic heating ♦ Gases ♦ Combustion
Abstract Newly developed atmospheric plasma abatement system is suitable to an abatement for single tool of oxide etcher and plasma enhanced CVD for chamber cleaning. Optimized performance of microwave plasma cavity enables to treat up to 80 L/min of CF/sub 4/ exhaust with 95% of DRE at the maximum power of 5.9 kW. This system is applicable to the flow rate range of 40 L/min to 80 L/min. We believe that our proposed plasma abatement system meets semiconductor industry requirements of minimizing COO for PFC reduction.
Description Author affiliation: Taiyo-Nippon Saonso Corp., Kanagawa, Japan (Mangyou, H.; Watanabe, N.; Hattori, K.; Watanabe, T.; Sugimori, Y.; Shibuya, K.; Hasaka, S.)
ISBN 0780391438
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2005-09-13
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 243.69 kB
Page Count 4
Starting Page 263
Ending Page 266


Source: IEEE Xplore Digital Library