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Author Chambers, B. ♦ Mahilingam, M.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1992
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Computer aided software engineering ♦ Thermal resistance ♦ Thermal force ♦ Semiconductor device packaging ♦ Electrical resistance measurement ♦ Clamps ♦ Resistance heating ♦ Force measurement ♦ Plastic packaging ♦ Manufacturing processes
Abstract The authors focus on the experimental results obtained from thermal resistance measurements made on 23 lead single-in-line (SIP-23) power packages. The experimental techniques employed in making the measurements are reviewed followed by a presentation of the experimental results. A generalized discussion is included of the effects of the various parameters on the package's thermal performance. These results are compared to other similar power packages such as the TO-218 and TO-220 discrete device packages. Some simple empirical models which may be of value to system designers are included.
Description Author affiliation: Motorola Inc., Phoenix, AZ, USA (Chambers, B.; Mahilingam, M.)
ISBN 0780305000
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1992-02-03
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 328.85 kB
Page Count 6
Starting Page 83
Ending Page 88


Source: IEEE Xplore Digital Library