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Author Ankireddi, S. ♦ Copeland, D.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2007
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Thermal resistance ♦ Cooling ♦ Semiconductor device packaging ♦ Microprocessors ♦ Computer architecture ♦ Power distribution ♦ Monte Carlo methods ♦ Power system management ♦ Thermal management ♦ Sun ♦ Monte Carlo analysis ♦ Hot blocks ♦ flip-chip ♦ package ♦ thermal resistance ♦ correlation
Abstract A flip-chip package with square die is considered in this study. Up to four square non-intersecting hot blocks are imposed on the die's otherwise uniform power distribution. Block locations on the die outline are randomly chosen with uniform probability. The power density of a given block is a random parameter, and is permitted to be as high as 10times the baseline uniform bulk power density. Additionally, the size of any block is also treated as a random parameter and is permitted to be as high as 10 % of the die area. A 6000-tuple Monte Carlo study of the packages is conducted, and the package thermal resistance $(R_{jc})$ noted in each case. A variety of models are fit to the $R_{jc}$ using the block characteristics as key variables, and their quality is characterized using the statistical correlation coefficient as a model metric. The results suggest a 96 % correlation between $R_{jc}$ and the largest product of local power ratio and square of effective local power density ratio among the blocks- providing a simple and useful method to immediately identify blocks with the most impact on $R_{jc}$ in a die floorplan.
Description Author affiliation: Semicond. Packaging, Sun Microsystems Inc., Sunnyvale, CA (Ankireddi, S.; Copeland, D.)
ISBN 1424409586
ISSN 10652221
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2007-03-18
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 202.38 kB
Page Count 5
Starting Page 69
Ending Page 73

Source: IEEE Xplore Digital Library