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Author Anton, C. ♦ Lecompte, J.P. ♦ Muntean, M.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2007
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Ceramics ♦ Micromechanical devices ♦ Gold ♦ Substrates ♦ Manufacturing ♦ Temperature ♦ Chemical elements ♦ Transmission line matrix methods ♦ Electronic mail ♦ Inorganic materials ♦ MEMS-Application ♦ Profiled-Ceramic
Abstract The present paper refers to realization of profiled ceramic micropackages (leadless inverted devices) for the mounting of MEMS application. Using corundum ceramic and electronic purity materials, the ceramic micropackages have been realized by adapting technological processes (deposition of metallic films, etching, etc.) and equipment specific to the electronic component industry. The joining of the gold terminals of the MEMS structure is performed by the gold - gold diffusion technique on the golden pads of the ceramic profiled matrices.
Description Author affiliation: Nat. Inst. for R&D in Microtechnologies, Bucharest (Anton, C.)
ISBN 9781424408474
ISSN 1545827X
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2007-10-15
Publisher Place Romania
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 2.01 MB
Page Count 4
Starting Page 123
Ending Page 126

Source: IEEE Xplore Digital Library